Simtek Attending TSIS 2026 in Orlando, Florida
- 5 days ago
- 2 min read

Every year, Simtek attends the Training & Simulation Industry Symposium (TSIS) to stay connected with the evolving needs of the U.S. military training community and to strengthen relationships with our customers and industry partners. We are proud to once again attend TSIS 2026, taking place June 17–18 in Orlando, Florida.
TSIS is one of the premier events focused on military training and simulation, bringing together Service procurement leaders, program managers, industry professionals, and decision-makers from across the Army, Navy, Marine Corps, and Air Force.
The symposium provides valuable insight into both near-term and long-term opportunities shaping the future of military training systems.
Attendees gain direct access to discussions surrounding acquisition strategies, funding priorities, modernization efforts, and program timelines through engaging panels and open Q&A sessions. For companies supporting defense training and simulation, TSIS offers a unique opportunity to better understand where the Services are headed and how industry can align solutions to support mission readiness.
For Simtek, this event represents more than just another conference. TSIS gives us the opportunity to meet face-to-face with our military customers, connect with long-time industry partners, and discuss the future of simulation technology in an increasingly demanding training environment.
As a long-standing provider of simulated avionics and cockpit solutions for military and commercial flight simulators, Simtek remains committed to delivering rugged, high-fidelity training hardware engineered for continuous use in mission-critical environments.
Events like TSIS allow us to stay engaged with the challenges our customers face while continuing to support the next generation of training systems.
We look forward to another great year at TSIS and the opportunity to continue building strong relationships throughout the defense training and simulation community.



